Tungsten Alloy Steel Plate and Sheet

Tungsten alloy plate is a composite material or high-density alloy plate formed by adding copper (Cu), nickel (Ni), iron (Fe) and other metals to tungsten (W) as the matrix, which combines the high temperature resistance and high-density characteristics of tungsten with the processing performance of other metals.

Basic Classification and Composition

1. Tungsten Copper Alloy Plate**

Composition : Tungsten content is 55% -80%, with the balance being copper (such as grades WD10055-WD10080).

-Features :

-High conductivity (conductivity 38% -49% IACS) and resistance to arc erosion, suitable for electric machining electrodes;

-Density 12.5-15.2 g/cm ³, hardness HRB 70-100, increases with increasing tungsten content.

2.  High density tungsten alloy plate

-Composition: Tungsten content of 90% -97%, combined with nickel, iron or copper (such as W-Ni-Fe, W-Ni-Cu series).

-Features:

-Density up to 16.5-19.0 g/cm ³ (30% lead, twice steel);

-Tensile strength of 800-1500 MPa, good ductility (elongation of 10% -30%).

Core performance advantages

1. Extreme environmental stability

-High temperature resistance>3000 ℃, anti burn (tungsten copper alloy); Low thermal expansion coefficient (1/2-1/3 of steel), high thermal conductivity (5 times that of mold steel).

2. Mechanical and functional characteristics

-Radiation shielding: It has a radiation absorption capacity 30% -40% higher than lead and is used in nuclear facilities and medical equipment.

-Machinability : Can be turned, milled, rolled, and even cold-rolled into ultra-thin plates (0.03-5.0 mm).

3. Special Electrical Properties (Tungsten Copper Alloy)

-High conductivity and resistance to electrical corrosion, suitable for high-voltage switches and spark electrodes.

Production process

1. Powder metallurgy dominant

-Compression sintering infiltration method: Used for tungsten copper alloys to ensure no pores and high density inside.

-Hot isostatic pressing (HIP): improves the compressive strength and polishing performance of hard alloy plates (such as the Kennametal CD series).

2. Molding process

-Hot rolled/warm rolled/cold rolled thin plates, surface can be polished and polished.

3. Special Process

-Skeleton infiltration method: Suitable for low copper content tungsten copper alloys to enhance airtightness.

Selection and application precautions

1. Brand selection

-The preferred electrode for electrical machining is tungsten copper alloy (such as CuW70, with a conductivity of 42% IACS); High tungsten alloy (W ≥ 90%) is selected for radiation shielding.

2. * * Corrosion resistant design**

-High density tungsten alloy requires surface treatment (such as sintering layer, polishing); Avoid direct contact with metals with large potential differences, such as steel.

3. * * Processing Restrictions**

-High temperature softening of tungsten copper alloy (>700 ℃); High density tungsten alloys have poor room temperature plasticity and require hot forming (150-300 ℃) for complex deformations.

Representative product parameters

1. Tungsten Copper Alloy Plate

-Specification * *: Thickness 2-50 mm, width ≤ 200 mm, length ≤ 400 mm.

-Performance Example :

|   Brand   | Tungsten Content | Density (g/cm ³) | Conductivity (% IACS) | Hardness (HRB)|

|--------|---------------|--------------|------------------|------------| 

| WD10070  |              70%      |                   13.9         |                            44             |                  82         | 

| WD10080  |                   80%    |                   15.2         |                            38             |                 100        | 

2. High density tungsten alloy plate

-Specifications: Ultra thin board 0.03-0.09 mm, regular board 0.2-5.0 mm, density 15.8-18.75 g/cm ³.

Advantages:

Tungsten alloy plate has become an irreplaceable material in the fields of military, energy, and precision manufacturing due to its ultra-high density, extreme environmental stability, and multifunctional characteristics. When selecting, it is necessary to balance the composition, process, and scene requirements (such as prioritizing tungsten copper for conductivity and high tungsten alloy for shielding), and pay attention to the compatibility of processing and anti-corrosion processes.